Abstract
The integration of nanofluid effects and channel shape effects in a heat sink, which exhibits both variable and constant cross-section, has gained significant traction as an efficient cooling method for thermal devices, particularly microelectronic devices. This research presents an experimental and numerical analysis to compare the performance of microchannel heat sink designs (straight, zigzag, wavy, and circular cavities). In addition, the study dealt with the use of pure water and nanofluid (CuO-H2O) with volumetric concentrations of (0.01, 0.02, and 0.03) as coolants. COMSOL Multiphysics was used for numerical analysis to simulate and solve the problem of fluid and heat flow in 3D. The bottom wall of the four microchannels is subjected to a steady heat flux of 170 kW/m2. The simulations were only performed within the laminar domain, encompassing a spectrum of Reynolds numbers ranging from 50 to 150. The influence on the microchannel's wall temperature, thermal resistance, pressure drop, and friction factor is exhibited. According to the findings, the wavy and zigzag microchannel heat sink cooled by nanofluid displays higher performance in terms of heat transmission and dissipation in comparison to the heat sink that was cooled by distilled water. as evidenced by a 12% increase in mussel number at volume concentrations of 0.03%.
